Download Capabilities Document
| Standard | Advanced | ||
| Metal Clad PCB | 510 x 610mm, 457 x 610mmm | Larger sizes available for long boards |
| Standard | |
| Aluminium | Denka, Ventec, Bergquist, Laird, and more |
| Other Materials | Please Enquire |
| Standard | Advanced | |
| Metal Clad PCB | 1oz (35µm) – 4oz (140µm) | Heavier weights achievable under consultation |
| Standard | Advanced | |
| Lead Free Hot Air Solder Level | Yes | Yes |
| OSP | Yes | Yes |
| Immersion Gold (ENIG) | Yes | Yes |
| ENEPIG | Yes | |
| Immersion Silver | Yes | |
| Immersion Tin | Yes |
| Standard | Advanced | |
| Photoimageable (LPI) Solder Mask | Green, White, Black, Red, Blue | Orange, Purple, Grey & Others on request |
| Peelable Solder Mask | Standard & Hi-Temp—Blue, Green, Red | Standard & Hi-Temp—Blue, Green, Red |
| UV Curable ident (Silkscreen) | White, Yellow, Black | Green, Red, Blue, Brown |
| Carbon Key Pads | Yes | Yes |
| Carbon Links | No | Yes |
| Standard | Advanced | |
| Min. Finished Hole Size (Mechanical) | 0.60mm x Material Thickness | Smaller considered on a case by case basis |
| Max. Finished Hole Size (Mechanical) | 5.90mm | Holes over 5.90mm diameter are routed |
| Minimum Punched Hole Size | 1.0mm x Material Thickness | |
| Minimum Router Diameter | 1.6mm | 1.6mm |
| Copper Thickness | Minimum Width | |
| 1oz (35um) | 0.005″ (0.13mm) | |
| 2oz (70um) | 0.006″ (0.15mm) | |
| 3oz (105um) | 0.007″ (0.18mm) | |
| 4oz (140um) | 0.008″ (0.20mm) | |
| 6oz (210um) | 0.010″ (0.25mm) | |
| 8oz (280um) | 0.015″ (0.38mm) | |
| 10oz (350um) | 0.015″ (0.38mm) |
| Copper Thickness | Minimum Width | |
| 1oz (35um) | 0.007″ (0.18mm) | |
| 2oz (70um) | 0.009″ (0.23mm) | |
| 3oz (105um) | 0.012″ (0.30mm) | |
| 4oz (140um) | 0.014″ (0.36mm) | |
| 6oz (210um) | 0.020″ (0.51mm) | |
| 8oz (280um) | 0.024″ (0.61mm) | |
| 10oz (350um) | 0.030″ (0.76mm) |
| Standard | ||
| Scored | 0.50mm | |
| Routed | 0.40mm | |
| Punched | One material thickness |
| Standard | ||
| Soldermask | The solder resist clearance around copper pads should be 0.1mm – this can be reduced to 0.05mm to maintain a 0.20mm solder dam | |
| Solder Dam Width | Min 0.20mm | |
| Solder Mask Pad Size | Min 0.30mm x 0.30mm | |
| Character Height (Text In Resist) | For the purposes of legible text, a minimum character height of 0.2mm is recommended |
| Standard | ||
| Minimum Character Height | 1.20mm | |
| Minimum Character Width | 0.25mm | |
| Minimum Text Line Thickness | 0.25mm | |
| Ident Text and Line to Copper Pad | 0.20mm – No ident text or lines to encroach onto copper pads | |
| Minimum Distance to Board Profile | 0.50mm |
| Drilled | Routed | ||
| Minimum Hole Edge to Circuit Profile | 1.0mm | One material thickness | |
| Minimum Hole to Hole Edge | 1.0mm | One material thickness | |
| Minimum Punched Profile Radius | 1.0mm |
| Standard | Advanced | |
| % Tested (Open / Short test) | 100% | 100% |
| Hi-Pot Breakdown Test | On Request | On Request |
| Standard | Quick Turn | |
| 10-15 Days | 3-5 Days |
| Standard | Quick Turn | |
| 10-15 Days + Shipping | 10 Days + Shipping |
| Air Freight Lead Time – 5 Days |
| Sea Freight Lead Time – 20 Days |
| All Far East lead times are subject to customs clearance |
| Premium International shipments can be arranged by DHL, Fedex, UPS or TNT at extra cost |
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