Can you offer plated and filled vias for ceramic circuits that are flat and dome free?

Yes, using DPC we can offer plated and filled vias with a flat and dome free finish. The design rule for the plating process to succeed is the thickness of the surface copper should be equal or greater than the radius of the via that needs to be filled. As an example, a 0.2mm via will need 0.1mm (100µm) of copper, so in this case the conductor copper weight needs to be, equal to or greater that, 100µm. We would use 3oz (105µm) copper in this example.

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