Unseen vias on either the top or bottom of a printed circuit board (PCB) are known as buried vias. It is used to connect layers of a PCB that are not on the surface, such as inner layers of a multi-layer PCB. Buried vias are typically smaller in diameter than surface vias and are typically created utilising laser drilling or etching processes. They can be utilised to decrease the size of a PCB and enhance performance by minimising signal crosstalk between layers.
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Daleba can manufacture PCBs ranging from single-sided to complex boards in excess of 40x layers. Our in-house CAM engineering resource allows us to rapidly check, panelise and commercially optimise a fast turnaround prototype as well as small volumes. We can supply simple technology boards in as little as 24 hours!
