HDI technology is used to create printed circuit boards (PCBs) that have a higher component density than traditional PCBs. This is achieved using smaller and more advanced technology, such as microvias, buried vias, and blind vias, which connect different layers of the PCB. These smaller vias allow for more layers to be packed into a smaller space, resulting in a more compact and efficient PCB.
HDI PCBs are used in a variety of electronic devices and applications, such as smartphones, laptops, tablets, and aerospace. They are smaller and thinner than traditional PCBs, which makes them ideal for portable devices where size and weight are important factors. They also have improved electrical performance, better thermal management, and better signal integrity compared to traditional PCBs.
However, HDI PCBs are more expensive to produce than traditional PCBs and require specialised equipment and expertise to manufacture. Despite this, their advantages make them an attractive option for many applications where size, weight, and performance are important factors. HDI technology is constantly evolving, and newer manufacturing methods are being developed that make HDI PCBs more cost-effective and efficient to produce, making them more accessible to various industries.