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DTE Pedestal Technology Breakthrough

Solving thermal issues with Direct Thermal Exchange Technology (DTE) / Pedestal Technology.

As technology continues to become increasingly sophisticated, the overheating of components continues to be a problem for many PCB Engineers. Although there are many solutions available, including IMS, copper based DTE (Direct Thermal Exchange Technology) Pedestal technology and of course, ceramic PCBs, there has always been a lack of options that balance effectiveness with cost and weight.

Ceramic substrate circuits are becoming more popular with their Thermal Conductivity values ranging from 24-180W/mK. However, manufacturing constraints such as size and cost do not make them a suitable PCB solution for everyone. IMS (Insulated Metal Substrates) can be an adequate solution for many, but it is limited to a TC range of 8-10W/mK.

DTE is another solution for thermal efficiency requirements. The biggest bottleneck of a metal core IMS is the dielectric, but with DTE the dielectric layer is bypassed by a direct copper plated connection through the dielectric to the metal base layer. These are often called Pedestals. This bypass of the dielectric layer allows heat to be transported with less thermal resistance. The outcome is to keep the components' temperature under control and extend the technology's life and operating performance.

Until now, the issue with DTE has been the base metal layer has to be copper and often thick copper to manage the thermal issues. Copper is expensive and a somewhat weighty option. This was the issue considered by our research department, and they chose to explore head-on, ultimately to look for a solution that would provide a lighter and more cost-effective option for our customers. Our research outcome was a brand new option for global technology companies that needed a cost-effective solution. DTE Pedestal technology is mostly provided using copper, and very often not the best or indeed, the lightest answer. To find an alternative is a real game-changer.

Exciting new tech delivered by DK-Daleba

Following our research, we have designed technology that bonds copper to aluminium. The outcome is a reduction in weight which can be considerable over a copper base layer.
Bonding aluminium to copper pedestals is also by far a most cost-effective. Aluminium is of course, cheaper and lighter. The technology needed to be robust and following a testing process of 1,000 cycles for thermal shock resistance, the new patent pending technology passed the test with flying colours.

DK-Daleba considers this addition to DTE technology or Pedestal technology as a real game-changer. Using plated copper to aluminium provides that interim solution for many. IMS may not suffice, DTE using just copper is expensive and bulky, Ceramics is certainly an option but can receive resistance where cost is concerned. However, DTE using aluminium as a base substrate is already well-received.

If you have thermal issues with components or are looking for a robust solution for your new technology, our engineers will support you in that quest. DK-Daleba can provide industry-leading solutions, and our research department is on hand to discover new opportunities in a continually evolving market.

Date : 14-01-2021

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