As with Heavy Copper FR4 circuits it is sometimes preferable to produce a ceramic circuit with both control and power elements on one layer to save costs and packaging space. The Direct Plated Copper (DPC) manufacturing method is still relatively new in the field of Ceramic Substrate PCBs. DPC involves vacuum sputtering under high temperature and pressure conditions to plate the copper to the substrate. As well as allowing for plated through holes this production method makes it viable to have a layer with different copper thicknesses in selected areas thus allowing for a control section and a power section on the same layer.
Date : 08-12-2021